ANSYS Multiphysics solutions
help cross-functional engineering
organizations predict the perfor-
mance of complex products in-
fluenced by multiple physics and
improve their designs through
simulations of the interactions
between physics.
Solver Technology
ANSYS, Inc.
www.ansys.com
ansysinfo@ansys.com
866.267.9724
© 2015 ANSYS, Inc.
All Rights Reserved.
Engineers used ANSYS Q3D Extractor
for parasitic extraction and ANSYS
Icepak for thermal characterization of
the power electronics of an electric drive
system PCB.
• Quasi-static 3D electromagnetic
field analysis using Method of Mo-
ments accelerated by Fast Multipole
Method
• DCRL, ACRL & CG Solver
• Quasi-static 2D electromagnetic
field analysis using Finite Element
Method
Extraction Types
• IC Packaging RLCG IBIS Extraction
for Signals & Power
• Touch panel RLCG Unit Cell
Extraction
• Bus Bar RLCG Extraction
• Power Inverter & Converter Compo
nent Extraction
• Specialized Thin Plane Solver for
Touch Panel Extraction
Meshing Technology
• Automatic, Adaptive Mesh
Refinement
Automation
• SPICE Equivalent Modeling Export
• 2D Transmission Line Modeling
Toolkit
• 2D Cable Modeling Toolkit
• 3D Component Library
• Macro-modeling (Network Data
Explorer)
High Performance Computing
• HPC Acceleration for DCRL, ACRL,
and CG
Multiphysics
• DCRL & ACRL Joule Heating Analysis
with Icepak
MKT0000128
